alt Hacker NewsIt's still unclear to me: the shortage is semiconductor boules / wafers? or the shortage is semiconductor fab process step availability?
As long as the discussion seems focused on memory, I'd suspect the latter, but if its really the semiconductor boules/wafers, then I'd expect the boule growers to profit, not the memory makers, who just pass on the cost.
So which is it?
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This covers it pretty well https://news.ycombinator.com/item?id=48229319, TLDR -memory for AI uses more wafers from same production line as other memory and is more profitable, building new fab very risky historically for companies. The companies have cut production of other memory to favor memory for AI and the market for memory for AI is still unfulfilled so prices still go up for customers of every type.
Regardless of the specific mechanics of the bottleneck, we know what the proximate source of the problem is: openai locking up 40% of Samsung and SK Hynix wafer capacity for the next few years. That's what triggered the madness.
There is a good article (featured on HN a couple of days ago) that explains the issue: https://davidoks.blog/p/ai-is-killing-the-cheap-smartphone
It’s fab capacity. Fwiw dram is different enough that fabs are not transferable between dram memory and other usages. It’s nice to think ‘wow if they made the current 10nm dram on the latest 2nm processes it’d be much faster’ but it doesn’t work that way. The specific size is needed for the capacitance. Sram can be made on fabs that make other circuitry since it’s transistor not capacitor based but is less dense.
Dram is just extremely specialised.