The root of this problem is linked to the difficulty of manufacturing chips at home. Some people are already doing this in their home lab (don't get me wrong the chemicals involved are really nasty).

The main problem is economical. Big factories benefits from economies of scale, which mean the ecosystem for one off prototypes chips couldn't really develop.

For advanced devices the transistor must be small so the process used ever-shrinking wavelength to engrave the silicon wafers. The whole industry took the Extreme-UV lithography route, which required big machines and investments.

But the alternative was there all-along (reminiscent of 3d-printer vs mass fabrication). Instead of using light to engrave the wafer use particles : For example mask-less electron beam lithography where you scan a beam of electron like in old TVs. It still have problems scaling up because you are writing a single point instead of projecting an image, but achievable resolution can be higher, and multi-beam systems are on the horizon to solve this speed issue.

With software and IP cost going down and humans no longer needed in the loop due to advanced robotics, most safety issues can be contained more easily.