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subroutineyesterday at 11:48 PM2 repliesview on HN

But Claude Opus 4.6 is not really practical. Taalas' process seems targeted for edge models. Their proof of concept model, for example, is a heavily quantized version of Llama 3.1 8B and even then they acknowledge their custom 3-bit/6-bit representation causes model quality degradation.

Taalas is going to have a tough time putting a trillion-parameter model on one conventional die. Their HC1 die is already near the maximum size that conventional lithography can expose. They claim they could partition the model across many chips, but I'm not sure if they have tested this process or what it means for compute. The basic storage arithmetic is unforgiving: for a one trillion parameters model at four bits it will take 50–100 chips. To service a sizable customer base will take thousands of 100-chip fabs.

That all said, I'm bullish on this technology, and look forward to seeing it evolve.


Replies

Iolaumtoday at 5:02 AM

A really fast qwen-3.6-27B type of model could be useful. With a specialized harness and this speed I 'd expect it to find many applications. Implementing a coding plan is the minimum I can think of.

vatsachaktoday at 12:31 AM

Yeah. But this kinda feels like a bandaid.

Eventually someone will have to solve compute in memory at scale.