alt Hacker NewsI did find it funny recently when Huawei when talking about its folded logic say the Vertical Bonding Pitch's are every 15,000 angstroms. It is a very fancy way of saying an interconnect every 1.5 microns.
I did find it funny recently when Huawei when talking about its folded logic say the Vertical Bonding Pitch's are every 15,000 angstroms. It is a very fancy way of saying an interconnect every 1.5 microns.
They should just say every 7 silicon atoms at that point.