alt Hacker NewsInteresting. LogicFolding is something that seems so obvious in retrospect and yet somebody has to be the first to do it.
I did find it neat that it ends up actually reducing overall heat despite the multiple layer wafers as signals have less overall distance to travel as they move in layer space rather than across the chip.
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amelius • today at 10:00 PM
But how can they patent this, as 3D chips have been built for decades already?
I mean, it is nice that they found out some properties (lower heat than expected), but you cannot patent that, I suppose.
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It moved the complexity from lithography to alignment