Aren't Huawei on the Entity List? How can Qualcomm enter into agreements like this without getting into massive hot water?
Will be interesting to see how Ericsson - if at all - responds to this
Remember when they were telling us how important the 5G race was and how critical was for the US to lead it?
And now they are just giving it away ?
It's not mentioned on Huawei page, but this bloomberg article claims that the focus in on LogicFolding architecture https://www.bloomberg.com/news/articles/2026-10-05/qualcomm-...
Meta question, but is the title of this article disappearing for others on HN? I'm unable to click. It seems all huawei.com links on this site have the same issue. Is it just me?
Haha next Nortel waiting to happen?
Qualcomm doing sneaky stuff as usual. Nothing more
"This transaction will close following receipt of the necessary regulatory approvals"
...potentially resulting in new AI-relevant chips.
Patents serve cartels. Good luck for innovative startups trying to enter this rigged game.
Ah yes, Huawei, that well known adherent to patent agreements.
Thanks Trump
Standard SEP mutual assured destruction.
Neither company can ship modern cellular basebands or RAN silicon without stepping on the other's portfolio. FRAND terms make endless global litigation a negative-ROI exercise, Entity List or not. Cross-licensing is the only operational path to extract rents and lock third parties out.
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This tells you that China:
1. is no longer a threat for the US
2. no longer has (perhaps never had), the lead
3. was forced to bow down because has no leverage
The US still chooses what customers China has access to
How the turntables etc.
Pre sanctions, HW fine buying QC for mobile chipset StandardEssentialPatentswhile QC pay HW for 5g SEPs, with net balance favoring QC. Huawei indigenized mobile SoC + 5g hardware with Kirin 9000 in 2023. Hilariously, now that Huawei weaned off QC SoC... QC simply stuck net paying Huawei.
Interesting. LogicFolding is something that seems so obvious in retrospect and yet somebody has to be the first to do it.
I did find it neat that it ends up actually reducing overall heat despite the multiple layer wafers as signals have less overall distance to travel as they move in layer space rather than across the chip.